Qualcomm today announced new 4g and 5g chipsets for connected vehicles. The chip maker sees the advanced communication platforms powering the next wave of in-vehicle experiences and telematics features including advanced automotive safety features and self-driving cars. Qualcomm says vehicles equipped with these chipsets are planned for production in 2021.
The Qualcomm Snapdragon Automotive 4G and Qualcomm Snapdragon Automotive 5G Platform feature C-V2X direct communications, high-precision multi-frequency global navigation satellite system (HP-GNSS) and RF Front-End (RFFE) functionalities — basically, the chipsets will give vehicles next level positioning capabilities.
Along with improved positioning, vehicles equipped with these Snapdragon platforms gain vehicle-to-vehicle and vehicle-to-infrastructure communications.
The Snapdragon Automotive 5G chipset is the first in the industry announced with support for dual SIM dual active — or DSDA, for short.
Qualcomm says it intends to give automakers the ability to test the platforms with a reference design kit in the second half of 2019.
It’s through chipsets like these that vehicles will gain autonomous driving capabilities. Without advanced, reliable connectivity, vehicles will not have access to the data needed to navigate across the ever-evolving urban landscape. While current systems are being used to some level of success, improved connectivity is ultimately needed to make good on the promise of self-driving cars.
Written by Matt Burns
This news first appeared on https://techcrunch.com/2019/02/25/qualcomms-new-4g-5g-platforms-to-bring-improved-telecommunication-to-vehicles/?utm_source=feedburner&utm_medium=feed&utm_campaign=Feed%3A+Techcrunch+%28TechCrunch%29 under the title “Qualcomm’s new 4G, 5G platforms to bring improved telecommunication to vehicles”. Bolchha Nepal is not responsible or affiliated towards the opinion expressed in this news article.
